Device and method for measuring a substrate
AssigneeEV Group E. Thallner GmbH
InventorsJacek Gasiorowski, Markus Wimplinger
Life of this patent
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AssigneeEV Group E. Thallner GmbH
InventorsJacek Gasiorowski, Markus Wimplinger
Estimating the term…
A method for measuring a multilayered substrate, particularly with at least one structure with critical dimensions, the method including the steps of (a) producing the substrate with a plurality of layers, particularly with a structure, wherein the dimensions of the layers and in particular the structures are known, (b) measuring the substrate using at least one measuring technology, (c) creating a simulation of the substrate using the measurement results from the measurement of the substrate, (d) comparing the measurement results with simulation results from the simulation of the substrate, and (e1) optimizing the simulation and renewed creation of a simulation of the substrate using the measurement results from the measurement of the substrate, in the event that there is a deviation of the measurement results from the simulation results, or (e2) calculating parameters of further substrates, in the event that the measurement results correspond to the simulation results.
A method for measuring a substrate having a plurality of layers, said method comprising:
A device for measuring a substrate having a plurality of layers, said device comprising:
Dependencies are inferred from the claim text.