Heat pump device
AssigneesDaikin Industries, Ltd., Daikin Europe N.V.
InventorsYuusuke Fujimoto, Ryuuichi Toyota, Kentaroh Taoka, Atsushi Ohtani, Kevin Cornelis, David Steen
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AssigneesDaikin Industries, Ltd., Daikin Europe N.V.
InventorsYuusuke Fujimoto, Ryuuichi Toyota, Kentaroh Taoka, Atsushi Ohtani, Kevin Cornelis, David Steen
Estimating the term…
A heat pump device having a refrigerant circuit includes: a valve configured to maintain an opening degree during non-energization; a valve drive circuit configured to cause operation of the valve; a valve controller configured to control the valve drive circuit; and a power source circuit configured to supply a power source to the valve drive circuit. The power source circuit includes: a first power source circuit unit configured to receive power source supply from outside to generate a DC voltage; and a second power source circuit unit for backup. The second power source circuit unit receives power source supply from the outside to store power in a capacitor, and connects the capacitor in parallel to a first output electric path of the first power source circuit unit.
A heat pump device including a refrigerant circuit, the heat pump device comprising:
Dependencies are inferred from the claim text.