Sputtering apparatus and related systems and methods for sputtering substrates

A sputtering system, comprising:

• a sputtering source;
• and
• a sputtering apparatus, comprising:
• a substrate holder assembly configured to support a plurality of elongated substrates relative to the sputtering source, each elongated substrate of the plurality of elongated substrates extending along a respective substrate axis;
• a holder drive assembly configured to rotate the substrate holder assembly about a holder axis;
• a substrate drive assembly comprising a substrate transmission operatively coupled between a drive source and the plurality of elongated substrates such that the substate transmission is configured to individually rotate each elongated substrate about the respective substrate axis for said elongated substrate, each respective substrate axis oriented perpendicular to the holder axis,
• wherein sputtered material is configured to be deposited onto the plurality of elongated substrates as the substrate holder assembly is being rotated about the holder axis simultaneous with rotation of each elongated substrate about the respective substrate axis for said elongated substrate,
• wherein the drive source comprises a common drive source with the holder drive assembly,
• wherein the holder drive assembly comprises a drive shaft coupled to the drive source and an intermediate shaft coupled to the drive shaft for rotation therewith about the holder axis, the substrate drive assembly including a gear-based transmission coupled between the intermediate shaft and the substrate transmission, and
• wherein the gear-based transmission comprises at least one intermediate gear supported by the intermediate shaft and a fixed ring gear configured to mesh with the at least one intermediate gear as the intermediate shaft and the at least one intermediate gear rotate together about the holder axis.