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US 12,467,119 B2Granted
Diamond sintered material and tool including diamond sintered material
AssigneesSumitomo Electric Hardmetal Corp., Sumitomo Electric Industries, Ltd.
InventorsHirotsugu Iwasaki, Akihiko Ueda, Michiko Matsukawa, Satoru Kukino, Kei Hirai
Life of this patent
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Abstract
A diamond sintered material includes diamond grains, wherein a content ratio of the diamond grains is more than or equal to 80 volume % and less than or equal to 99 volume % with respect to the diamond sintered material, an average grain size of the diamond grains is more than or equal to 0.1 μm and less than or equal to 50 μm, and a dislocation density of the diamond grains is more than or equal to 8.1×1013 m−2 and less than 1.0×1016 m−2.
Claims5
A diamond sintered material comprising diamond grains, wherein
- a content ratio of the diamond grains is more than or equal to 80 volume % and less than or equal to 99 volume % with respect to the diamond sintered material,
- an average grain size of the diamond grains is more than or equal to 0.1 μm and less than or equal to 50 μm, and
- a dislocation density of the diamond grains is more than or equal to 8.1×1013 m−2 and less than 1.0×1016 m−2.
Dependencies are inferred from the claim text.