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AssigneeShengyi Technology Co., Ltd.
InventorsQing Wang, Qianfa Liu, Dongliang Liu, Jinchao Dong, Songgang Chai, Yongjing Xu, Yanhua Zhang
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A resin composition and the use thereof. The resin composition comprises the following components, in percentages by weight: 40-70% of a crosslinkable and curable resin and 30-60% of a filler. The filler is silicon dioxide prepared by means of an organosilicone hydrolysis method; the average particle size D50 of the silicon dioxide is 0.1-3 μm; and the particle size ratio D100:D10 of the silicon dioxide is less than or equal to 2.5. By means of the composition, a prepared adhesive film and resin-coated copper foil have a higher elongation rate, a higher peel strength, low CTE, low Df, better drilling processability and higher electrical strength. A finer line processing capability can be achieved, which can be applied to a printed circuit board material of a multilayer laminate, in particular a printed circuit board material of a multilayer laminate of thin lines.
A resin composition, which comprises the following components by weight percentage:
A resin-coated copper foil, which comprises a copper foil and a resin composition adhered to the copper foil after coating and drying,
A semi-cured prepreg, which is formed by impregnating fiberglass cloth with resin composition according and drying the same, wherein the resin composition comprises the following components by weight percentage:
Dependencies are inferred from the claim text.