Thin film support structures
AssigneeLifeLens Technologies, LLC
InventorsLandy Toth, Robert S. Schwartz
Life of this patent
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Abstract
A method includes forming a film, forming a first pattern of two or more vias at least partially through the film, attaching the film to a first support structure, the first support structure comprising an adhesive layer formed over a first carrier, wherein attaching the film to the first support structure comprises bonding a first surface of the film to the adhesive layer of the first support structure, wherein the film is stretchable in at least a first direction along the first surface, and wherein the first carrier maintains the first pattern of vias within a given threshold distortion following a given process conducted after attaching the film to the first support structure.
Claims18
A method comprising:
- providing a patch, the patch comprising:
- a first support structure comprising an adhesive layer formed over a first carrier;
- and
- a film attached to the first support structure and comprising a first pattern of two or more vias formed at least partially therethrough, a first surface of the film being bonded to the adhesive layer of the first support structure, the film being stretchable in at least a first direction along the first surface;
- one or more microelectronic structures, the one or more microelectronic structures being at least one of:
- formed in at least one of the vias;
- and formed as a pattern on a second surface of the film, the second surface of the film being opposite the first surface of the film;
- at least one functional layer formed over the second surface of the film, the at least one functional layer comprising one or more wrinkles enabling stretching of the at least one functional layer in the first direction along the first surface;
- a surface adhesive formed over at least a portion of the at least one functional layer;
- and
- a liner attached to the surface adhesive;
- wherein the first carrier comprises a material having a rigidity that maintains the first pattern of vias within a given threshold distortion following a given process conducted after the film is attached to the first support structure;
- removing at least a portion of the liner to expose at least a first region of the surface adhesive;
- attaching the patch to a first structure by bonding the exposed first region of the surface adhesive to a first surface of the first structure;
- and
- removing at least a portion of the first carrier.
Dependencies are inferred from the claim text.