Apparatus and method for a deformable EMI shielding structure
AssigneeIntel Corporation
InventorsBernardo Mora Villalobos, Alonso Rodriguez Chacon
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Abstract
A shielding structure and method for assembling a shielding structure for an electronic component. The shielding structure includes a core comprising an elastic material and at least a spring part of the core comprising an arch. The structure further includes an electromagnetic interference (EMI) shielding material affixed to the core. The method for producing the shielding structure includes forming a core comprising an elastic material, wherein the core includes at least a spring part comprising one or more arches. The method further includes covering at least a part of the core in an EMI shielding material.
Claims19
A shielding structure for an electronic component, the shielding structure comprising:
- a core comprising an elastic material and at least a spring part of the core comprising an arch,
- wherein an electromagnetic interference (EMI) shielding material is affixed to the core;
- and
- a coreless part comprising the EMI shielding material.
An electronic device comprising:
- a shielding structure comprising a core comprising
- an elastic material and at least a spring part of the core comprising an arch;
- and
- an EMI shielding material affixed to the core,
- wherein the shielding structure at least partially, laterally surrounds an electrical component on a circuit board, and
- a stiffening structure arranged atop the shielding structure, wherein the stiffening structure applies a compressive force to the shielding structure when affixed to the circuit board.
A method for producing a shielding structure for an electronic component, the method comprising:
- forming a core comprising an elastic material, wherein the core includes at least a spring part comprising an arch,
- affixing an EMI shielding material to the core, and
- forming a coreless part comprising the EMI shielding material.
Dependencies are inferred from the claim text.