Trace arrangement for printed circuit board
AssigneeCisco Technology, Inc.
InventorsShadi Ebrahimi Asl, Stephen Aubrey Scearce, Linda W. Scott
Life of this patent
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Abstract
A method of manufacturing a printed circuit board (PCB) includes arranging a first trace segment of a trace on a substrate of the PCB, the substrate being composed of fiber glass strands that define a fiber glass weave pattern, and arranging a second trace segment of the trace on the substrate at a position that is fractionally offset from the first trace segment along an axis by a distance that is less than a ball grid array (BGA) pitch of a BGA based on the fiber glass weave pattern. The BGA pitch is a separation distance along the axis between a center of a first via of the BGA of the PCB and a center of a second via of the BGA.
Claims20
A printed circuit board (PCB), comprising:
- a substrate composed of a fiber glass material woven together to create a fiber glass weave pattern;
- a first trace comprising a first plurality of trace segments electrically coupled to one another, wherein the first plurality of trace segments comprises a first trace segment and a second trace segment fractionally offset from one another along an axis by a first distance that is less than a ball grid array (BGA) pitch of a BGA of the PCB, the BGA pitch being a separation distance along the axis between a center of a first via of the BGA and a center of a second via of the BGA, and wherein the first trace segment extends between the first via and the second via;
- and
- a second trace comprising a second plurality of trace segments electrically coupled to one another, wherein the second plurality of trace segments comprises a third trace segment and a fourth trace segment fractionally offset from one another along the axis by a second distance that is less than the BGA pitch to extend the first plurality of trace segments and the second plurality of trace segments along corresponding layouts of the fiber glass weave pattern of the substrate, wherein the third trace segment extends alongside the first trace segment external to the first via and the second via.
A method of manufacturing a printed circuit board (PCB), comprising:
- arranging a first trace segment of a trace on a substrate of the PCB to extend along a first axis and within a space extending between a first via of a ball grid array (BGA) and a second via of the BGA, wherein the substrate is composed of fiber glass strands that define a fiber glass weave pattern;
- and
- arranging a second trace segment of the trace on the substrate at a position that is fractionally offset from the first trace segment along a second axis, transverse to the first axis, by a distance that is less than a BGA pitch based on the fiber glass weave pattern such that the second trace segment is offset from the space extending between the first via and the second via, wherein the BGA pitch is a separation distance along the second axis between a center of the first via of the BGA and a center of the second via of the BGA.
A printed circuit board (PCB), comprising:
- a substrate composed of a plurality of fiber glass strands that are woven together to create a fiber glass weave pattern;
- a first trace comprising a first plurality of trace segments electrically coupled to one another, wherein the first plurality of trace segments comprises a first trace segment and a second trace segment extending along a first axis and fractionally offset from the first trace segment along a second axis, transverse to the first axis, in a first direction by a first distance;
- and
- a second trace comprising a second plurality of trace segments electrically coupled to one another, wherein the second plurality of trace segments comprises a third trace segment and a fourth trace segment extending along the first axis and fractionally offset from the third trace segment along the second axis in a second direction, opposite the first direction, by a second distance to extend the first plurality of trace segments and the second plurality of trace segments along corresponding layouts of the fiber glass weave pattern of the substrate, the first trace segment and the third trace segment extending alongside one another, and the second trace segment and the fourth trace segment extending alongside one another.
Dependencies are inferred from the claim text.