Processing apparatus for electronic component

A processing apparatus for an electronic component, the apparatus comprising:

• a transport drive unit;
• a support portion provided to be driven by the transport drive unit to rotate about a central axis of a circular orbit passing through an inspection position;
• a component holding portion supported by the support portion on the circular orbit;
• the component holding portion including a suction portion configured to hold an electronic component;
• a posture sensor;
• a posture adjustment unit provided in the support portion and including a rotation drive unit configured to rotate the suction portion;
• and
• a plurality of processing units provided to correspond to a plurality of stop positions;
• each processing unit of the plurality of processing units including a visual inspection unit, the transport drive unit being configured to stop the component holding portion at the plurality of stop positions;
• each visual inspection unit including
• an imaging unit;
• a position sensor;
• a focus adjustment unit;
• and
• a branch portion,
• wherein the imaging unit is configured to image an inspection surface of the electronic component held by the component holding portion disposed at the inspection position;
• wherein the position sensor is configured to acquire position information indicating a position of the inspection surface in a condition that the electronic component is held by the component holding portion;
• wherein the focus adjustment unit is configured to adjust a focus of the imaging unit on the inspection surface based on the position information in the condition that the electronic component is held by the component holding portion,
• wherein the posture sensor is configured to acquire posture information indicating a posture of the inspection surface with respect to the imaging unit in the condition that the electronic component is held by the component holding portion,
• wherein the posture adjustment unit is configured to adjust the posture of the inspection surface with respect to a depth of field by the imaging unit based on the posture information by rotating the component holding portion holding the electronic component around a central axial line of the component holding portion, prior to an imaging of the inspection surface by the imaging unit,
• wherein the position sensor is configured to acquire the position information in a state where the component holding portion that holds the electronic component is disposed at the inspection position,
• wherein the branch portion is configured to branch light from the inspection surface into first light that travels to the imaging unit and second light that travels to the position sensor, and
• wherein an optical path of laser light to be used for acquiring the position information in the position sensor coincides with an optical axis of a camera of the imaging unit between the inspection surface and the branch portion.