Semiconductor substrate, and manufacturing method and manufacturing apparatus of semiconductor substrate

A semiconductor substrate comprising:

• a template substrate comprising a first seed region, a growth restricting region, and a second seed region that are aligned in a first direction in a plan view;
• a first semiconductor part that is positioned above the template substrate and connected to the first seed region;
• and
• a second semiconductor part that is positioned above the template substrate and connected to the second seed region,
• wherein
• the first semiconductor part comprises (i) a first base, which is in contact with the template substrate and defined by a vertically extending section of the first semiconductor part that contacts the template substrate, and (ii) a first wing which is not in contact with the template substrate, is adjacent to the first base, and extends from the first base in the first direction,
• the first wing comprises a wing edge which is positioned above and suspended over the growth restricting region and is spaced apart from the second semiconductor part by a gap interposed between the wing edge and the second semiconductor part,
• the gap being configured to prevent physical contact between the first wing and the second semiconductor part,
• the growth restricting region comprises a top surface on an upper side of the template substrate, the top surface having a first portion that faces the first wing, and
• a first ratio, which is defined by a width of the first wing in the first direction divided by a shortest vertical distance from the first portion of the top surface of the growth restricting region to the wing edge, is equal to or larger than 5.0.