System for predicting properties of structures, imager system, and related methods

A method, comprising:

• receiving first image data from an imager system, the first image data relating to at least one first wafer lot;
• receiving measured metrology data from metrology equipment of the at least one first wafer lot;
• training a machine learning model with the first image data and the measured metrology data;
• and
• applying one or more machine learning techniques to the first image data and the measured metrology data to generate at least one predictive model for predicting at least one of virtual metrology data or virtual cell metrics data of wafer lots,
• wherein the first image data includes images of every wafer within the at least one first wafer lot and the measured metrology data of the at least one first wafer lot includes metrology measurements for only a portion of wafers of the at least one first wafer lot.