Indirect evaporative cooling apparatus and cooling system including the same
AssigneeKorea Institute of Machinery & Materials
InventorsJungchul Kim, Dong Ho Kim, Seok Ho Yoon, Young Kim
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Abstract
The present disclosure relates to an indirect evaporative cooling apparatus and a cooling system including the same, and more particularly, to an indirect evaporative cooling apparatus including a plurality of evaporation modules each including a first module and a second module, and a cooling system including the same. According to the present disclosure, it is possible to provide an indirect evaporative cooling device that maximizes cooling efficiency and space efficiency, and a cooling system including the same.
Claims20
An indirect evaporative cooling apparatus comprising a plurality of evaporation modules each of which comprises a first module and a second module disposed to face the first module,
- wherein each of a plurality of first modules and a plurality of second modules comprises:
- a heat transfer plate configured to provide heat transfer;
- a hydrophilic plate disposed to face the heat transfer plate and formed of a porous material capable of absorbing water;
- a hydrophobic plate disposed to face the hydrophilic plate on an opposite side of the heat transfer plate and having pores, working fluid flowing through the hydrophobic plate on a side opposite to a side facing the hydrophilic plate;
- and
- a water supply device configured to supply water to the hydrophilic plate,
- wherein in each of the evaporation modules, a first flow path through which the working fluid flows is formed between the first module and the second module,
- wherein a second flow path through which a cooling target fluid flows is formed between two of the evaporation modules adjacent to each other.
Dependencies are inferred from the claim text.