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US 12,460,295 B2Granted
Stability of refractory materials in high temperature steam
AssigneeThe Regents of the University of Colorado
InventorsAlan W. Weimer, Amanda Hoskins, Charles Musgrave
Life of this patent
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Abstract
The present invention relates, in part, to a discovery of a method for using atomic layer deposition (ALD) to improve the stability of refractory materials in high temperature steam, and compositions produced by the method.
Claims20
An article comprising a ceramic substrate and a conformal film less than 15 nanometers thick on a surface of the ceramic substrate, the conformal film formed by atomic layer deposition and comprising alumina and silicon dioxide.
Dependencies are inferred from the claim text.