Resin composition for molding and molded article
AssigneeSekisui Chemical Co., Ltd.
InventorsTomohiro Horinouchi, Mitsuo Matsumoto, Ryota Yamasugi, Yoshito Arai, Yasunari Kusaka, Nami Nakajima
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AssigneeSekisui Chemical Co., Ltd.
InventorsTomohiro Horinouchi, Mitsuo Matsumoto, Ryota Yamasugi, Yoshito Arai, Yasunari Kusaka, Nami Nakajima
Estimating the term…
The present invention provides a resin composition for molding having excellent thermal meltability and capable of providing a molded article that is less likely to crack from a resin weld during use and has excellent surface gloss, and a molded article including the resin composition for molding. Provided is a resin composition for molding, containing: a chlorinated polyvinyl chloride resin; a polyvinyl chloride resin; and a melt additive, the resin composition having an area ratio of a peak B observed in a range of 0.6 to 1.0 ppm to a peak A observed in a range of 9.5 to 10 ppm (Area of peak B/Area of peak A) of 1 to 1,000 when a 1H NMR spectrum is measured by solution NMR.
A resin composition for molding, comprising:
Dependencies are inferred from the claim text.