Method for manufacturing joined body and device for manufacturing joined body
AssigneeNippon Electric Glass Co., Ltd.
InventorToru Shiragami
Life of this patent
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Abstract
In a method for producing a bonded body, a bonding step includes a supporting step of mounting a laminate on a support device, and a pressing step of pressing the laminate. The support device includes a pressing member configured to press the laminate, a base member supporting the pressing member, a supporting member configured to support the laminate, and a fixing mechanism configured to fix the supporting member to the base member. In the supporting step, the fixing mechanism fixes the supporting member to the base member.
Claims12
A method for producing a bonded body including a first substrate, a second substrate, and a sealing layer bonding the first substrate and the second substrate, the method comprising:
- laminating to form a laminate by overlapping the first substrate and the second substrate while interposing a sealing material between the first substrate and the second substrate;
- and
- bonding to form the sealing layer by irradiating the sealing material in the laminate with a laser beam,
- wherein the bonding includes supporting to mount the laminate on a support device, pressing the laminate, and performing laser irradiation to irradiate the sealing material with the laser beam,
- wherein the support device includes
- a pressing member configured to press the laminate,
- a base member supporting the pressing member,
- a supporting member configured to support the laminate, and
- a fixing mechanism configured to fix the supporting member to the base member,
- wherein the fixing mechanism includes
- a fixing member including a head and a shaft, and
- a hole formed in the supporting member and through which the shaft is insertable, and
- wherein the supporting includes fixing the supporting member to the base member by the fixing mechanism.
A method for producing a bonded body, including a first substrate, a second substrate, and a sealing layer bonding the first substrate and the second substrate, the method comprising:
- laminating to form a laminate by overlapping the first substrate and the second substrate while interposing a sealing material between the first substrate and the second substrate;
- and
- bonding to form the sealing layer by irradiating the sealing material in the laminate with a laser beam,
- wherein the bonding includes supporting to mount the laminate on a support device, pressing the laminate, and performing laser irradiation to irradiate the sealing material with the laser beam,
- wherein the support device includes
- a pressing member configured to press the laminate,
- a base member supporting the pressing member,
- a supporting member configured to support the laminate, and
- a fixing mechanism configured to fix the supporting member to the base member,
- wherein the fixing mechanism includes
- a fixing member including a head and a shaft,
- a hole formed in the supporting member and through which the head and the shaft are insertable,
- a recessed portion formed in the supporting member and configured to lock the head, and
- a guide groove formed in the supporting member and through which the shaft is relatively moved between the hole and the recessed portion, and
- wherein the supporting includes fixing the supporting member to the base member by the fixing mechanism.
A device for producing a bonded body, the bonded body including a first substrate, a second substrate, and a sealing layer bonding the first substrate and the second substrate, the device comprising:
- a support device configured to support a laminate formed by overlapping the first substrate and the second substrate while interposing a sealing material between the first substrate and the second substrate;
- and
- a laser irradiation device configured to irradiate the sealing material of the laminate with a laser beam to form the sealing layer,
- wherein the support device includes
- a pressing member configured to press the laminate,
- a base member supporting the pressing member,
- a supporting member configured to support the laminate, and
- a fixing mechanism configured to fix the supporting member to the base member,
- wherein the fixing mechanism includes
- a fixing member including a head and a shaft, and
- a hole formed in the supporting member and through which the shaft is insertable, and
- wherein the supporting member is fixed to the base member by the fixing mechanism.
A device for producing a bonded body, the bonded body including a first substrate, a second substrate, and a sealing layer bonding the first substrate and the second substrate, the device comprising:
- a support device configured to support a laminate formed by overlapping the first substrate and the second substrate while interposing a sealing material between the first substrate and the second substrate;
- and
- a laser irradiation device configured to irradiate the sealing material of the laminate with a laser beam to form the sealing layer,
- wherein the support device includes
- a pressing member configured to press the laminate,
- a base member supporting the pressing member,
- a supporting member configured to support the laminate, and
- a fixing mechanism configured to fix the supporting member to the base member,
- wherein the fixing mechanism includes
- a fixing member including a head and a shaft,
- a hole formed in the supporting member and through which the head and the shaft are insertable,
- a recessed portion formed in the supporting member and configured to lock the head, and
- a guide groove formed in the supporting member and through which the shaft is relatively moved between the hole and the recessed portion, and wherein the supporting member is fixed to the base member by the fixing mechanism.
Dependencies are inferred from the claim text.