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US 12,459,077 B2Granted
Processing method and processing apparatus for workpiece
AssigneeSintokogio, Ltd.
InventorsToshiya Tsuji, Yuji Kobayashi
Life of this patent
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Abstract
A processing method according to one aspect incudes preparing a metal workpiece having a hole that opens to a surface thereof, filling the hole with processing media, and applying an external force to the processing media to apply a compressive residual stress to an inner surface of the hole.
Claims7
A processing method, comprising:
- preparing a metal workpiece having a hole that opens to a surface thereof;
- filling the hole with processing media;
- and
- applying an external force to the processing media to plastically deform an inner surface of the hole, thereby applying a compressive residual stress to the inner surface of the hole.
1 more element
Dependencies are inferred from the claim text.