Production method for integrated circuits

An integrated circuit (IC) production method, comprising:

• receiving, by an IC forming machine, a leadframe comprising a plurality of in-production ICs;
• singulating, by the IC forming machine, the plurality of in-production ICs;
• forming, by the IC forming machine, leads of at least some of the plurality of in-production ICs to comply with intended dimensions and tolerances corresponding to the plurality of in-production ICs;
• and
• separating, automatically by the forming machine, formed ICs from unformed ICs after the forming, wherein the formed ICs fall via gravity through a void in the forming machine and the unformed ICs are prevented from falling through the void in the forming machine.

An integrated circuit (IC) production method, comprising:

• receiving, by an IC forming machine, a leadframe comprising a plurality of in-production ICs;
• singulating, by the IC forming machine, the plurality of in-production ICs;
• forming, by the IC forming machine, leads of at least some of the plurality of in-production ICs to comply with intended dimensions and tolerances corresponding to the plurality of in-production ICs;
• and
• separating, automatically by the forming machine, formed ICs from unformed ICs after the forming, wherein the unformed ICs fall via gravity through a void in the forming machine and the formed ICs are prevented from falling through the void in the forming machine.

A method of making integrated circuit (ICs), comprising:

• singulating ICs from a leadframe;
• forming leads of the singulated ICs;
• and
• automatically separating the singulated ICs having formed leads and first dimensions from the singulated ICs having formed leads and other than the first dimensions after the forming without human intervention to perform the separating.

A method of making integrated circuit (ICs), comprising:

• singulating ICs from a leadframe;
• forming leads of the singulated ICs;
• and
• automatically separating the singulated ICs having formed leads and first dimensions from the singulated ICs having formed leads and other than the first dimensions after the forming without human intervention to perform the separating, wherein an aperture based means is used for automatically separating the singulated ICs having first dimensions from the singulated ICs having other than the first dimensions.

A method of making integrated circuit (ICs), comprising:

• singulating in-production ICs from a leadframe;
• forming the in-production ICs according to intended dimensions upon which the forming is at least partially based by means for forming the in-production ICs;
• and
• automatically separating formed ICs from unformed ICs by a means for forming the in-production ICs, after the forming without human intervention to perform the separating, wherein the means for the automatically separating the formed ICs is detachably coupled to at least a portion of the means for forming the in-productions ICs.

A method of making integrated circuit (ICs), comprising:

• singulating ICs from a leadframe;
• forming leads of the singulated ICs;
• and
• automatically separating the singulated ICs having formed leads and first dimensions from the singulated ICs having formed leads and other than the first dimensions after the forming without human intervention to perform the separating wherein a transporting means advances the singulated ICs having the first dimensions to a first location in a forming machine and the singulated ICs having other than the first dimensions to a second location in the forming machine.

A method of making integrated circuit (ICs), comprising:

• singulating in-production ICs from a leadframe;
• forming the in-production ICs according to intended dimensions upon which the forming is at least partially based;
• and
• automatically separating formed ICs from unformed ICs after the forming without human intervention to perform the separating, wherein the formed ICs fall via gravity through a void in a forming machine and the unformed ICs are prevented from falling through the void in the forming machine.

A method of making integrated circuit (ICs), comprising:

• singulating in-production ICs from a leadframe;
• forming the in-production ICs according to intended dimensions upon which the forming is at least partially based;
• and
• automatically separating formed ICs from unformed ICs after the forming without human intervention to perform the separating, wherein the unformed ICs fall via gravity through a void in a forming machine and the formed ICs are prevented from falling through the void in the forming machine.

A method of making an integrated circuit (IC), comprising:

• singulating the IC from a leadframe;
• forming leads of the IC;
• and
• automatically separating the singulated IC based upon dimensions of the singulated IC from other singulated ICs having different dimensions after the forming without human intervention to perform the separating.

A method of making an integrated circuit (IC), comprising:

• singulating the IC from a leadframe;
• forming leads of the IC;
• and
• automatically separating the singulated IC based upon dimensions of the singulated IC from other singulated ICs having different dimensions after the forming without human intervention to perform the separating, wherein an aperture based means is used for automatically separating the in-production ICs having first dimensions from the in-production ICs having other than the first dimensions.

A method of making an integrated circuit (IC), comprising:

• singulating the IC from a leadframe;
• forming the IC according to intended dimensions upon which the forming is at least partially based by a means for forming in-production ICs;
• and
• automatically separating the formed IC from unformed ICs by a means for automatically separating the formed ICs after the forming without human intervention to perform the separating, wherein the means for the automatically separating the formed ICs is detachably coupled to at least a portion of the means for forming the in-productions ICs.

A method of making an integrated circuit (IC), comprising:

• singulating the IC from a leadframe;
• forming leads of the IC;
• and
• automatically separating the singulated IC based upon dimensions of the singulated IC from other singulated ICs having different dimensions after the forming without human intervention to perform the separating, wherein a transporting means advances the ICs having the first dimensions to a first location in a forming machine and the ICs having other than the first dimensions to a second location in the forming machine.

A method of making an integrated circuit (IC), comprising:

• singulating the IC from a leadframe;
• forming the IC according to intended dimensions upon which the forming is at least partially based;
• and
• automatically separating the formed IC from unformed ICs after the forming without human intervention to perform the separating, wherein the formed ICs fall via gravity through a void in a forming machine and the unformed ICs are prevented from falling through the void in the forming machine.

A method of making an integrated circuit (IC), comprising:

• singulating the IC from a leadframe;
• forming the IC according to intended dimensions upon which the forming is at least partially based;
• and
• automatically separating the formed IC from unformed ICs after the forming without human intervention to perform the separating, wherein the unformed ICs fall via gravity through a void in a forming machine and the formed ICs are prevented from falling through the void in the forming machine.