Steam treatment stations for chemical mechanical polishing system
AssigneeApplied Materials, Inc.
InventorsHaosheng Wu, Jianshe Tang, Hari Soundararajan, Shou-Sung Chang, Hui Chen, Chih Chung Chou, Alexander John Fisher, Paul D. Butterfield
Life of this patent
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Abstract
An apparatus for steam treatment of a conditioner head and/or conditioner disk in a chemical mechanical polishing system includes a conditioner cleaning cup, a boiler to generate steam, one or more nozzles positioned to direct steam inwardly into a cavity defined by the load cup, and a supply line running from the boiler to the one or more nozzles to supply steam to the one or more nozzles.
Claims14
A method of steam treatment of a carrier head or a substrate in a chemical mechanical polishing system, comprising:
- receiving a carrier head and/or substrate in a substrate loading cup of the chemical mechanical polishing system;
- and
- directing steam onto the carrier head and/or substrate in the loading cup to clean and/or preheat the carrier head and/or substrate.
A method of steam treatment of a conditioner head and/or conditioner disk in a chemical mechanical polishing system, comprising:
- receiving a conditioner head in a conditioner cleaning cup of the a chemical mechanical polishing system;
- and
- directing steam onto the conditioner head and/or conditioner disk in the cleaning cup to clean and/or preheat the conditioner head and/or conditioner disk.
Dependencies are inferred from the claim text.