Substrate processing method and substrate processing apparatus
AssigneeSCREEN Holdings Co., Ltd.
InventorsLinh da Ho, Masaki Inaba, Kei Suzuki
Life of this patent
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Abstract
A substrate processing method for removing an organic film on a substrate includes a) carrying out introduction of ozone-containing gas into a substrate processing chamber to fill at least a space above the substrate in the substrate processing chamber with ozone-containing gas, b) starting spraying through the space a heated chemical liquid containing sulfuric acid onto the substrate after the a), c) continuing the spraying started in the b), and d) stopping the spraying continued in the c).
Claims2
A substrate processing method for removing an organic film on a substrate, the substrate processing method comprising:
- a) introducing an ozone-containing gas into a substrate processing chamber to fill at least a space above said substrate in said substrate processing chamber with ozone-containing gas;
- b) starting spraying through said space a heated chemical liquid containing sulfuric acid onto said substrate by using a high-speed gas flow of an inert gas after said a);
- c) continuing said spraying started in said b);
- and
- d) stopping said spraying continued in said c), wherein
- said b) includes supplying said chemical liquid to an atomization nozzle spraying said chemical liquid by a chemical liquid supply unit, said chemical liquid supply unit includes a first pipe connected to said atomization nozzle, a second pipe connected to a sulfuric acid tank, a third pipe, and a three-way valve connected to said first pipe, said second pipe, and said third pipe,
- said chemical liquid sprayed in said c) is separated into a first liquid collected by being received by a cup section surrounding said substrate and a second liquid collected to said third pipe outside said cup section, and
- switching states between a state in which a liquid in the sulfuric acid tank is sprayed and a state in which said second liquid not containing said first liquid is sprayed again, by operating said three-way valve.
A substrate processing apparatus for removing an organic film on a substrate, the substrate processing apparatus comprising:
- a substrate processing chamber;
- a substrate holder configured to hold said substrate in said substrate processing chamber;
- an ozone supplier configured to supply ozone-containing gas into said substrate processing chamber;
- an atomization nozzle configured to spray a chemical liquid onto said substrate;
- a chemical liquid supplier including a heater and configured to supply said chemical liquid heated by said heater to said atomization nozzle, said chemical liquid supplier including a first pipe connected to said atomization nozzle, a second pipe connected to a tank for said chemical liquid, a third pipe, and a three-way valve to which said first pipe, said second pipe and said third pipe are connected;
- a gas supplier configured to supply an inert gas to said atomization nozzle;
- a controller configured to control said ozone supplier to fill at least a space above said substrate in said substrate processing chamber with ozone-containing gas, and then control said chemical liquid supplier to start spraying said chemical liquid through said space onto said substrate;
- and
- a cup section configured to receive said chemical liquid discharged into a surrounding of said substrate, said third pipe being disposed to collect said chemical liquid discharged outside said cup section.
Dependencies are inferred from the claim text.