Organic planar diode with CU electrode via modification of the metal surface by SAM of fluorobiphenyl based thiol

Abstract

A surface of a copper (Cu) electrode is modified by a combination of preliminary oxidation treatment and grafting of a bifunctional self-assembled monolayer based on fluorobiphenylthiol (FBPS) or biphenylthiol (BPS). Under these conditions, a dinaphtho[2,3-b:2′,3′-f]thieno[3,2-b]thiophene (DNTT)-based diode exhibits high mobility (0.35 cm2·V−1·s−1) due to the formation of an organized assembly of FBPS on copper oxide that has been partially reduced to Cu2O. This organization controls that of a semiconductor film. On the other hand, the same treatment of a copper electrode with BPS molecules does not function due to the disorganization of both the BPS self-assembled monolayer (SAM) and the DNTT film. These results suggest that a monolayer of dipole-oriented molecules lowers an injection barrier and determines the semiconductor organization, thereby improving the performance of derived electronic parts.

Dependencies are inferred from the claim text.