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US 12,457,808 B2Granted
Photon detector array assembly
AssigneeTexas Instruments Incorporated
InventorsEduardo Bartolome, Rakul Viswanath
Life of this patent
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Abstract
In a described example, an apparatus includes: a photon detector array with a first signal output pad coupled to a photon detector array pixel; a die carrier comprising a readout integrated circuit (ROIC) die and a conductor layer having conductors that couple a first signal input pad on the conductor layer to an input signal lead of the ROIC die; and the first signal output pad coupled to the first signal input pad.
Claims35
A method, comprising:
- attaching read out integrated circuit (ROIC) dies and through leads on a substrate;
- filling spaces on the substrate with a mold compound;
- forming a first layer on the ROIC dies, the through leads, and the mold compound, the first layer including a dielectric layer and conductors that couple bond pads of the ROIC dies to signal input pads on the first layer;
- forming conductive members on the signal input pads;
- removing the substrate;
- and
- cutting through the first layer and the mold compound to form die carriers, wherein each die carrier includes at least one of the ROIC dies and one or more of the through leads and wherein a pitch of the conductors in the first layer close to the ROIC dies is smaller than a pitch of the conductors in the first layer close to the signal input pads.
4 more elements
A method, comprising:
- mounting read out integrated circuit (ROIC) dies on a substrate;
- filling spaces between the ROIC dies with a mold compound;
- forming a first layer on the ROIC dies and the mold compound, the first layer including a dielectric layer and conductors that couple bond pads of the ROIC dies to first signal input pads on the first layer;
- forming first conductive members on the first signal input pads;
- removing the substrate;
- cutting the first layer and the mold compound between the ROIC dies;
- providing an interposer including at least one wiring layer, the interposer having;
- second signal input pads on a first surface of the interposer;
- and
- signal output pads on a second surface of the interposer, the second surface opposite the first surface, wherein wires in the at least one wiring layer couple the second signal input pads to the signal output pads;
- forming second conductive members on the second signal input pads;
- and
- forming first conductive pathways between the signal output pads and the first signal input pads using the first conductive members.
10 more elements
A method, comprising:
- attaching an integrated circuit (IC) die and one or more through leads on a substrate;
- filling spaces on the substrate with a mold compound;
- forming a first layer on the IC die, the one or more through leads, and the mold compound, the first layer including a dielectric layer and conductors that couple bond pads of the IC die to conductive pads on the first layer;
- and
- removing the substrate, wherein the IC die, the one or more through leads, and the first layer form a die carrier and wherein a pitch of the conductors in the first layer close to the IC die is smaller than a pitch of the conductors in the first layer close to the conductive pads.
2 more elements
Dependencies are inferred from the claim text.