Image data generation device and component mounting system

An image data generation device that generates image data for displaying an arrangement state of multiple electronic components after mounting processing of mounting the multiple electronic components on a board is executed, the image data generation device comprising:

• a component information input section configured to input a mounting position and an outer shape of an electronic component for each of the multiple electronic components to be mounted in the mounting processing, the mounting position including a position in a height direction orthogonal to a surface of the board;
• and
• an image data generation section configured to generate the image data for displaying a state when each of the multiple electronic components to be mounted in the mounting processing is arranged at the mounting position of the electronic component based on the mounting position and the outer shape of the electronic component input by the component information input section, the image data generation section being configured to generate the image data for displaying one of the electronic component and an other electronic component, which is mounted on a board side, in a first aspect, and for displaying the other electronic component in a second aspect that is different from the first aspect, based on the position of the electronic component in the height direction, which is input by the component information input section, when the electronic component mounted in the mounting processing is mounted on a position overlapping with the other electronic component, and positions of the electronic component and the other electronic component in the height direction of the board are different from each other when the board after the mounting processing is viewed in plan view, and to generate the image data for displaying the electronic component and the other electronic component in a third aspect that is different from the first aspect and the second aspect, when the electronic component mounted in the mounting processing is mounted on a position overlapping with the other electronic component, and the positions of the electronic component and the other electronic component in the height direction of the board are the same when the board after the mounting processing is viewed in plan view.