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US 12,456,961 B2Granted
Acoustic wave device and wafer with support substrate having an uneven surface, and manufacturing method of wafer
AssigneeTaiyo Yuden Co., Ltd.
InventorsShinji Yamamoto, Michio Miura
Life of this patent
Estimating the term…
Abstract
An acoustic wave device includes a support substrate having an uneven surface, a piezoelectric layer provided on the uneven surface of the support substrate, an electrode that excites an acoustic wave in the piezoelectric layer, and an insulating layer that is provided between the uneven surface of the support substrate and the piezoelectric layer, and has an air gap located in a recess part of the uneven surface.
Claims13
An acoustic wave device comprising:
- a support substrate having an uneven surface;
- a piezoelectric layer provided on the uneven surface of the support substrate;
- an electrode that excites an acoustic wave in the piezoelectric layer;
- and
- an insulating layer that is provided between the uneven surface of the support substrate and the piezoelectric layer, and has an air gap located in a recess part of the uneven surface, an upper portion of the air gap being covered with the insulating layer and a side portion of the air gap being surrounded by the insulating layer.
2 more elements
A wafer comprising:
- a support substrate having an uneven surface;
- a piezoelectric layer provided on the uneven surface of the support substrate;
- and
- an insulating layer that is provided between the uneven surface of the support substrate and the piezoelectric layer, and has an air gap located in a recess part of the uneven surface, an upper portion of the air gap being covered with the insulating layer and a side portion of the air gap being surrounded by the insulating layer.
1 more element
Dependencies are inferred from the claim text.