Heat insulation structure, substrate processing apparatus, method of manufacturing semiconductor device and substrate processing method

A heat insulation structure arranged in a vicinity of a furnace opening of a heat treatment furnace wherein a temperature gradient is formed at the vicinity of the furnace opening, comprising:

• a plurality of heat insulation plates with predetermined gaps therebetween,
• wherein each heat insulation plate comprises:
• a heat shield made of a metal;
• and
• a seal constituted by a pair of sealing plates and made of quartz or ceramics, and configured to cover a front surface and a rear surface of the heat shield, the pair of sealing plates being connected to each other over an entire circumference of each of the pair of sealing plates, and
• wherein the heat shield of each of the plurality of heat insulation plates is supported in a vacuum cavity provided in the seal without making a surface contact with the pair of sealing plates so that the heat shield is arranged in the vacuum cavity.

A heat insulation structure arranged in a vicinity of a furnace opening of a heat treatment furnace wherein a temperature gradient is formed at the vicinity of the furnace opening, comprising:

• a plurality of heat insulation plates with predetermined gaps therebetween,
• wherein each heat insulation plate comprises:
• a heat shield made of a metal;
• and
• a seal constituted by a pair of sealing plates and made of quartz or ceramics, and configured to cover a front surface and a rear surface of the heat shield,
• wherein the heat shield is arranged between the pair of sealing plates, and
• wherein the heat shield of each of the heat insulation plates is provided with at least one through-hole through which the front surface of the heat shield is in communication with the rear surface of the heat shield, and the pair of sealing plates are connected to each other at an entire circumference of each of the pair of sealing plates and in the at least one through-hole.