Replacement gate methods that include treating spacers to widen gate
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsShu-Han Chen, Tsung-Ju Chen, Ta-Hsiang Kung, Xiong-Fei Yu, Chi On Chui
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsShu-Han Chen, Tsung-Ju Chen, Ta-Hsiang Kung, Xiong-Fei Yu, Chi On Chui
Estimating the term…
A method may include forming a dummy dielectric layer over a substrate, and forming a dummy gate over the dummy dielectric layer. The method may also include forming a first spacer adjacent the dummy gate, and removing the dummy gate to form a cavity, where the cavity is defined at least in part by the first spacer. The method may also include performing a plasma treatment on portions of the first spacer, where the plasma treatment causes a material composition of the portions of the first spacer to change from a first material composition to a second material composition. The method may also include etching the portions of the first spacer having the second material composition to remove the portions of the first spacer having the second material composition, and filling the cavity with conductive materials to form a gate structure.
A device, comprising:
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Dependencies are inferred from the claim text.