Substrate processing apparatus and method of manufacturing semiconductor device using the same

A substrate processing apparatus, comprising:

• a substrate stage in a chamber for performing a development process on a photoresist layer on a semiconductor substrate, the substrate stage being configured to support the semiconductor substrate and being rotatable at a predetermined angular velocity;
• a discharge device configured to discharge a chemical solution onto the photoresist layer, and the discharge device including:
• a nozzle over the semiconductor substrate movable from a center of the semiconductor substrate in a radial direction, wherein the nozzle is configured to discharge the chemical solution onto the semiconductor substrate at a predetermined angle relative to a surface of the semiconductor substrate;
• and
• an angle changer configured to change the predetermined angle such that the predetermined angle gradually decreases as the nozzle moves from the center of the semiconductor substrate to a peripheral region;
• and
• a control device configured to change the predetermined angular velocity and the predetermined angle according to a position of the nozzle.

A substrate processing apparatus, comprising:

• a substrate stage in a chamber for performing a development process on a semiconductor substrate, the substrate stage being configured to support the semiconductor substrate and being rotatable at a predetermined angular velocity;
• a discharge device including a nozzle arm, a nozzle, and an angle changer, the nozzle arm being movable along a radial direction from a central region of the semiconductor substrate disposed on the substrate stage to a peripheral region surrounding the central region, the nozzle being on the nozzle arm and being configured to discharge a chemical solution onto the semiconductor substrate in a linear velocity direction in which the semiconductor substrate rotates, at a predetermined angle relative to a surface of the semiconductor substrate, and the angle changer being configured to change the predetermined angle such that the predetermined angle gradually decreases as the nozzle arm moves from the central region to the peripheral region;
• and
• a control device configured to control the predetermined angular velocity and the predetermined angle according to a position of the nozzle.