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US 12,454,636 B2Granted
Adhesive film for polishing pad, laminated polishing pad including the same and method of polishing wafer
AssigneeEnpulse Co., Ltd.
InventorsJung Nam Lee, Sunghoon Yun, Jangwon Seo
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Abstract
An adhesive film for a polishing pad including a plurality of through holes extended from a top surface to a bottom surface of the adhesive film, wherein a volume fraction of the plurality of through holes is 3% to 20% based on a total volume of the adhesive film, is disclosed.
Claims14
An adhesive film for a polishing pad comprising:
- a plurality of through holes extended from a top surface to a bottom surface of the adhesive film,
- wherein a volume fraction of the plurality of through holes is 3% to 20% based on a total volume of the adhesive film,
- wherein the adhesive film has a compressive ratio of 0.98% or more and 3.3% or less, the compressive ratio being calculated by (thickness loss after compression/original thickness of the adhesive film)×100%, when the adhesive film is compressed in a thickness direction under a pressure of 6.89 kPa to 48.26 kPa,
- wherein a cross-sectional shape of each of the plurality of through holes, when viewed on a plane perpendicular to the thickness direction of the adhesive film, is substantially the same, and
- wherein each of the plurality of through holes has an average cross-sectional area from 6 mm2 to 100 mm2, where the average cross-sectional area is obtained by dividing a total cross-sectional area of the plurality of through holes, which is measured on a plane perpendicular to a thickness direction of the adhesive film, by a total number of the plurality of through holes.
2 more elements
A laminated polishing pad comprising:
- a polishing pad;
- and
- an adhesive film for the polishing pad attached to one surface of the polishing pad,
- wherein the adhesive film comprises a plurality of through holes extended from a top surface to a bottom surface of the adhesive film,
- wherein a volume fraction of the plurality of through holes is 3% to 20% based on a total volume of the adhesive film,
- wherein the adhesive film has a compressive ratio of 0.98% or more and 3.3% or less, the compressive ratio being calculated by (thickness loss after compression/original thickness of the adhesive film)×100%, when the adhesive film is compressed in a thickness direction under a pressure of 6.89 kPa to 48.26 kPa, and
- wherein each of the plurality of through holes has an average cross-sectional area from 6 mm2 to 100 mm2, where the average cross-sectional area is obtained by dividing a total cross-sectional area of the plurality of through holes, which is measured on a plane perpendicular to a thickness direction of the adhesive film, by a total number of the plurality of through holes.
4 more elements
A method of polishing a wafer comprising:
- preparing a laminated polishing pad attached to a plate and a polishing head, to which a wafer is fixed;
- and
- rotating any one or both of the plate and the polishing head, while contacting the wafer with the laminated polishing pad with adding slurry,
- wherein the laminated polishing pad comprises:
- a polishing pad;
- and
- an adhesive film for the polishing pad attached to one surface of the polishing pad,
- wherein the polishing pad comprises a plurality of through holes extended from a top surface to a bottom surface of the adhesive film,
- wherein a volume fraction of the plurality of through holes is 3% to 20% based on a total volume of the adhesive film,
- wherein the adhesive film has a compressive ratio of 0.98% or more and 3.3% or less, the compressive ratio being calculated by (thickness loss after compression/original thickness of the adhesive film)×100%, when the adhesive film is compressed in a thickness direction under a pressure of 6.89 kPa to 48.26 kPa, and
- wherein each of the plurality of through holes has an average cross-sectional area from 6 mm2 to 100 mm2, where the average cross-sectional area is obtained by dividing a total cross-sectional area of the plurality of through holes, which is measured on a plane perpendicular to a thickness direction of the adhesive film, by a total number of the plurality of through holes.
8 more elements
Dependencies are inferred from the claim text.