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US 12,454,032 B2Granted
Substrate processing apparatus
AssigneeTDK Corporation
InventorsYohei Sato, Hiroshi Koizumi, Osamu Shindo, Mitsuyoshi Makida, Masashi Matsumoto
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Abstract
A substrate processing apparatus including a lower jig plate for arranging a substrate which is an object to be pressurized, columnar members supporting the lower jig plate, and a heat dissipating column contacting the lower jig plate directly or indirectly and having a higher heat dissipation property than the columnar members.
Claims5
A substrate processing apparatus comprising
- a lower jig plate for arranging an object to be pressurized,
- columnar members supporting the lower jig plate, and
- a heat dissipating column contacting the lower jig plate directly or indirectly and having a higher heat dissipation property than the columnar members, wherein
- the heat dissipating column includes
- a column main body, and
- a cover portion covering the column main body and comprising a material with a higher thermal conductivity than the column main body.
3 more elements
Dependencies are inferred from the claim text.