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US 12,453,291 B2Granted
Semiconductor die with sensor section located at the edge
AssigneeInfineon Technologies AG
InventorsMomtchil Stavrev, Dirk Meinhold
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Abstract
A semiconductor die is proposed, wherein the semiconductor die comprises a microelectronic section and a sensor section. The microelectronic section comprises an integrated circuit. The sensor section adjoins an edge of the semiconductor die. A sensor is also proposed, which comprises such a semiconductor die.
Claims20
A semiconductor die comprising:
- a microelectronic section,
- wherein the microelectronic section comprises an integrated circuit;
- and
- a sensor section,
- wherein a first side of the sensor section adjoins an edge of the semiconductor die,
- wherein a step formed by a plurality of metallization layers of the microelectronic section is present only on a second side of the sensor section that is opposite of the first side of the sensor section,
- wherein the sensor section is configured to be positioned above a mounting surface of a housing,
- wherein the sensor section is free of any wetting by an adhesive that mechanically connects the semiconductor die to the mounting surface of the housing, and
- wherein a barrier prevents a mechanical connection from being produced between the sensor section and the mounting surface of the housing when the semiconductor die is mounted on the mounting surface of the housing.
6 more elements
A sensor comprising:
- a semiconductor die comprising:
- a microelectronic section that comprises an integrated circuit;
- and
- a sensor section, wherein a first side of the sensor section adjoins an edge of the semiconductor die, and wherein a step formed by a plurality of metallization layers of the microelectronic section is present only on a second side of the sensor section that is opposite of the first side of the sensor section;
- a housing, wherein the housing comprises:
- a mounting surface,
- a contact terminal, and
- a housing contacting surface electrically conductively connected to the contact terminal;
- and
- a bonding wire,
- wherein bonding wire electrically conductively connects a die-contacting surface to the housing contacting surface,
- wherein the die-contacting surface is located on a side of the microelectronic section facing away from the sensor section,
- wherein the sensor section is configured to be positioned above the mounting surface,
- wherein the sensor section is free of any wetting by an adhesive that mechanically connects the semiconductor die to the mounting surface, and
- wherein a barrier prevents a mechanical connection from being produced between the sensor section and the mounting surface when the semiconductor die is mounted on the mounting surface.
12 more elements
Dependencies are inferred from the claim text.