US 12,451,455 B2 · Systems and methods for direct bonding in semiconductor die manufacturing

Abstract

A method for bonding semiconductor dies, resulting semiconductor devices, and associated systems and methods are disclosed. In some embodiments, the method includes depositing a first material on the first semiconductor die. The first material has a first outer surface and a first chemical composition at the first outer surface. The method also includes depositing a second material on the second semiconductor die. The second material has a second outer surface and a second chemical composition at the second outer surface that is different from the first chemical composition. The method also includes stacking the dies. The second outer surface of the second semiconductor die is in contact with the first outer surface of the first semiconductor die in the stack. The method also includes reacting the first outer surface with the second outer surface. The reaction causes the first outer surface to bond to the second outer surface.

Claims16

Dependent claims

A method for bonding semiconductor dies, the method comprising:

depositing a first dielectric on a first semiconductor die, wherein the first dielectric includes a first material and a second material in a first molecular ratio at a first surface of the first dielectric;
depositing a second dielectric on a second semiconductor die, wherein the second dielectric includes the first material and the second material in a second molecular ratio different from the first molecular ratio at a second surface of the second dielectric;
stacking the second semiconductor die and the first semiconductor die with the first surface in contact with the second surface;
and
bonding the first surface with the second surface by diffusing the second material from the second dielectric to the first dielectric.

2 more elements

A method for bonding a first semiconductor die to a second semiconductor die, the method comprising:

depositing a first material on the first semiconductor die, wherein the first material has a first outer surface, and wherein the first material has a first chemical composition at the first outer surface;
depositing a second material on the second semiconductor die, wherein the second material has a second outer surface, and wherein the second material has a second chemical composition at the second outer surface that is different from the first chemical composition;
stacking the second outer surface of the second semiconductor die in contact with the first outer surface of the first semiconductor die;
and
reacting the first outer surface with the second outer surface, the reaction causing the first outer surface to bond to the second outer surface.

2 more elements

Dependencies are inferred from the claim text.

Systems and methods for direct bonding in semiconductor die manufacturing

Life of this patent

Systems and methods for direct bonding in semiconductor die manufacturing

Life of this patent

Abstract

Claims16