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US 12,451,415 B2Granted
Semiconductor device package, electronic assembly and method for manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsCheng-Lin Ho, Chih-Cheng Lee, Chun Chen Chen, Cheng Yuan Chen
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Abstract
A semiconductor device package includes a carrier, an electronic component, a connection element and an encapsulant. The electronic component is disposed on a surface of the carrier. The connection element is disposed on the surface and adjacent to an edge of the carrier. The encapsulant is disposed on the surface of the carrier. A portion of the connection element is exposed from an upper surface and an edge of the encapsulant.
Claims13
An electronic assembly, comprising:
- a structure including a substrate, a protection layer disposed on the substrate, and a conductive layer disposed on the substrate;
- and
- a semiconductor device package electrically connected to the conductive layer by a connection element, wherein the semiconductor device package has a short side and has a long side substantially perpendicular to the substrate in a cross-sectional perspective,
- wherein the protection layer exposes a portion of the conductive layer, and the connection element covers the portion of the conductive layer, and
- wherein the semiconductor device package comprises:
- a carrier and an electronic component disposed on a lateral surface of the carrier;
- and
- a conductive structure connected to the carrier and the connection element, wherein an elevation of the conductive structure is lower than an elevation of the electronic component with respect to the substrate.
5 more elements
An electronic assembly, comprising:
- a structure including a substrate and a conductive layer disposed on the substrate;
- and
- a semiconductor device package electrically connected to the conductive layer by a connection element, wherein the semiconductor device package has a short side and a long side substantially perpendicular to the substrate in a cross-sectional perspective,
- wherein the connection element comprises a stepped portion defined by the conductive layer, and
- wherein the structure further comprises a protection layer disposed over the substrate and exposing a portion of an upper surface of the substrate and a portion of the conductive layer.
2 more elements
Dependencies are inferred from the claim text.