Lithography apparatus and method

A method comprising:

• generating a plasma in a processing chamber by striking a tin droplet with a laser beam, a byproduct of the tin droplet being distributed on a vane in the processing chamber, an upper temperature of an upper portion of the vane being greater than a lower temperature of a lower portion of the vane during generation of the plasma;
• reducing a difference between the upper temperature and the lower temperature by heating the lower portion of the vane;
• after reducing the difference between the upper temperature and the lower temperature, melting the byproduct of the tin droplet on the vane by heating the upper portion of the vane and the lower portion of the vane with a heating element, the heating element extending along a length of the vane;
• and
• evacuating the melted byproduct of the tin droplet from the processing chamber.

An apparatus comprising:

• a plasma generator;
• a light collector;
• a byproduct transport ring above the light collector, the byproduct transport ring comprising a first heating element;
• a drain line extending through the byproduct transport ring;
• a vane above the byproduct transport ring;
• a second heating element extending along a length of the vane;
• a controller configured to:
• generate a plasma above the light collector with the plasma generator, a plasma generation byproduct being distributed on the vane when the plasma is generated;
• heat the first heating element of the byproduct transport ring to reduce a temperature difference between an upper portion and a lower portion of the vane;
• and
• after reducing the temperature difference, heat the second heating element to melt the plasma generation byproduct distributed on the vane, the plasma generation byproduct dripping into the drain line.