Composition for forming resist underlayer film with improved film density
AssigneeNissan Chemical Corporation
InventorsHikaru Tokunaga, Masashi Ohno, Rikimaru Sakamoto, Keisuke Hashimoto
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AssigneeNissan Chemical Corporation
InventorsHikaru Tokunaga, Masashi Ohno, Rikimaru Sakamoto, Keisuke Hashimoto
Estimating the term…
A resist underlayer film formation composition including a novolak resin that has a repeating unit structure represented by the following formula (1). (In formula (1), groups A and B are organic groups which each have an aromatic ring, a fused aromatic ring, or a fused aromatic heterocycle and have a structure in which two or more mono- or divalent chemical groups selected from the group consisting of chemical groups (a) that cause an increase in mass upon oxidation, groups (b) that form a crosslink upon heating, and groups (c) that induce phase separation during curing have replaced hydrogen atoms on the ring(s) contained in group A and/or B.) The composition further includes a crosslinking agent and an acid and/or acid generator. A production process is provided in which the resist underlayer film formation composition is applied to a semiconductor substrate and burned to obtain a resist underlayer film.
A method for producing a resist underlayer film, the method comprising applying and baking a resist underlayer film-forming composition on a semiconductor substrate so as to obtain the resist underlayer film,
A method for producing a semiconductor device, the method comprising:
A method for producing a semiconductor device, the method comprising:
A resist underlayer film-forming composition comprising a novolak resin having a repeating unit structure selected from the group consisting of:
Dependencies are inferred from the claim text.