Light adjusting structure, light adjusting module and light adjusting device

A light adjusting structure, comprising one or two light adjusting functional layers stacked, wherein each light adjusting functional layer comprises a plurality of functional sub-layers distributed in different regions, each functional sub-layer comprises a first substrate and a second substrate disposed opposite to each other, a first electrode and a second electrode respectively disposed on sides of the first substrate and the second substrate facing each other, a first alignment layer and a second alignment layer respectively disposed on sides of the first electrode and the second electrode facing each other, and a dye liquid crystal layer between the first alignment layer and the second alignment layer;

• at least one of first substrates or second substrates of the functional sub-layers constitute a full-layer planar substrate, one of first electrodes or second electrodes of the functional sub-layers are disposed at an interval, and the other one of the first electrodes or the second electrodes of the functional sub-layers are disposed at an interval or constitute a full-layer planar electrode, dye liquid crystal layers of the functional sub-layers each comprise a sealant disposed between the first alignment layer and the second alignment layer in a surrounding mode, and dye molecules and liquid crystal molecules disposed in a space surrounded by the sealant, sealants of the functional sub-layers are disposed at an interval, and spaces surrounded by the sealants of the functional sub-layers are isolated from each other,
• wherein each of the first electrodes and the second electrodes of the functional sub-layers are provided with at least one bonding part, outside a transmittance adjusting region in which the electrodes are located, for bonding with a flexible circuit board,
• wherein each light adjusting functional layer comprises three functional sub-layers, and at least one of the first electrodes or the second electrodes of the functional sub-layers are disposed at an interval, and comprises a first electrode region, a second electrode region and a third electrode region, and the first electrode region and the second electrode region are disposed on a same side of the third electrode region,
• one bonding part is provided, and is disposed on a side of the first electrode region and the third electrode region away from the first electrode region or the second electrode region,
• the first electrode region or the second electrode region is provided with an extension part, and an end of the extension part passes through the interval between the second electrode region and the third electrode region or the interval between the first electrode region and the third electrode region, and extends to the side where the bonding part is located,
• the bonding part comprises three bonding sub-parts which are spaced apart from each other, the second electrode region, the third electrode region and the extension part, or, the first electrode region, the third electrode region and the extension part are bonded with the flexible circuit board through the three bonding sub-parts respectively.

A light adjusting structure, comprising one or two light adjusting functional layers stacked, wherein each light adjusting functional layer comprises a plurality of functional sub-layers distributed in different regions, each functional sub-layer comprises a first substrate and a second substrate disposed opposite to each other, a first electrode and a second electrode respectively disposed on sides of the first substrate and the second substrate facing each other, a first alignment layer and a second alignment layer respectively disposed on sides of the first electrode and the second electrode facing each other, and a dye liquid crystal layer between the first alignment layer and the second alignment layer;

• at least one of first substrates or second substrates of the functional sub-layers constitute a full-layer planar substrate, one of first electrodes or second electrodes of the functional sub-layers are disposed at an interval, and the other one of the first electrodes or the second electrodes of the functional sub-layers are disposed at an interval or constitute a full-layer planar electrode, dye liquid crystal layers of the functional sub-layers each comprise a sealant disposed between the first alignment layer and the second alignment layer in a surrounding mode, and dye molecules and liquid crystal molecules disposed in a space surrounded by the sealant, sealants of the functional sub-layers are disposed at an interval, and spaces surrounded by the sealants of the functional sub-layers are isolated from each other,
• wherein each of the first electrodes and the second electrodes of the functional sub-layers are provided with at least one bonding part, outside a transmittance adjusting region in which the electrodes are located, for bonding with a flexible circuit board,
• wherein each light adjusting functional layer comprises three functional sub-layers, and at least one of the first electrodes or the second electrodes of the functional sub-layers are disposed at an interval, and comprises a first electrode region, a second electrode region and a third electrode region, and the first electrode region and the second electrode region are disposed on a same side of the third electrode region,
• two bonding parts are provided, wherein one bonding part is a first bonding part and is disposed on a side, away from the third electrode region, of the first electrode region and the second electrode region, and the other bonding part is a second bonding part and is disposed on a side, away from the first electrode region or the second electrode region, of the third electrode region,
• the first bonding part comprises two bonding sub-parts which are spaced apart from each other, and the first electrode region and the second electrode region are respectively bonded with one flexible circuit board through the two bonding sub-parts, and the third electrode region is bonded to another flexible circuit board by the second bonding part.