Composition for forming thermally conductive material, thermally conductive material, and surface-modified inorganic substance

A composition for forming a thermally conductive material, comprising:

• a surface-modified inorganic substance;
• and
• a thermosetting compound,
• wherein the surface-modified inorganic substance satisfies at least one of the following Requirement 1 or Requirement 2,
• Requirement 1:
• The surface-modified inorganic substance is a surface-modified inorganic substance X containing an inorganic substance, and a surface modifier A and a surface modifier B adsorbed on a surface of the inorganic substance, the surface modifier A and the surface modifier B each independently have one or more adsorbent groups selected from the group consisting of an alkoxysilyl group, an aldehyde group, and a boronic acid group, and one or more aromatic rings, the total number of monocyclic aromatic ring structures in the one or more aromatic rings is 2 or greater, the surface modifier A further has one or more functional groups A selected from the group consisting of an epoxy group, an oxetanyl group, and an isocyanate group, the surface modifier B further has one or more functional groups B selected from the group consisting of a hydroxyl group, —NHRT, a carboxyl group, a thiol group, or a phosphoric acid group, and RT represents a hydrogen atom or an alkyl group,
• Requirement 2:
• The surface-modified inorganic substance includes a surface-modified inorganic substance A containing an inorganic substance and the surface modifier A adsorbed on the surface of the inorganic substance, and not containing the surface modifier B, and a surface-modified inorganic substance B containing an inorganic substance and the surface modifier B adsorbed on the surface of the inorganic substance, and not containing the surface modifier A.