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US 12,448,485 B2Granted
Photosensitive resin composition, photosensitive resin coating, photosensitive dry film, pattern formation method
AssigneeShin-Etsu Chemical Co., Ltd.
InventorHitoshi Maruyama
Life of this patent
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Abstract
Provided is a photosensitive resin composition that includes: a silicone resin (A) having an epoxy group and/or a phenolic hydroxyl group; an alkyl phenol novolac resin (B) indicated by formula (B); and a photoacid generator (C). (In the formula, R51 is a C1-9 saturated hydrocarbyl group. R52 is a C10-25 saturated hydrocarbyl group. n1 and n2 are numbers that fulfil 0≤n1<1, 0<n2≤1, and n1+n2=1. m1 represents an integer from 0 to 3 and m2 represents an integer from 1 to 3.)
Claims13
A photosensitive resin composition comprising
- (A) a silicone resin containing an epoxy group and/or phenolic hydroxy group, the silicone resin having the formula (A):
- wherein R1 to R4 are each independently a C1-C8 monovalent hydrocarbon group, k is an integer of 1 to 600, a and b are numbers in the range:
- 0<a<1, 0<b<1, and a+b=1, and X is a divalent organic group containing an epoxy group and/or phenolic hydroxy group,
- (B) an alkyl phenol novolak resin having the formula (B):
- wherein R51 is a C1-C9 saturated hydrocarbyl group, R52 is a C10-C25 saturated hydrocarbyl group, n1 and n2 are numbers in the range:
- 0≤n1<1, 0<n2≤1, and n1+n2=1, m1 is an integer of 0 to 3, and m2 is an integer of 1 to 3, and
- (C) a photoacid generator.
4 more elements
Dependencies are inferred from the claim text.