Low thermal conductivity and low-k dielectric aerogel material and preparation method therefor
AssigneeTaiwan Aerogel Technology Material Co., Ltd.
InventorsJean-Hong Chen, Shiu-Shiu Chen
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AssigneeTaiwan Aerogel Technology Material Co., Ltd.
InventorsJean-Hong Chen, Shiu-Shiu Chen
Estimating the term…
The present invention discloses the an aerogel material featuring of low thermal conductivity, low dielectric constant (low-DK) and low dielectric-loss (low-DF) and a preparation method therefor. The method comprises steps of: (1) mix and hydrolysis, (2) dispersion and condensation, (3) molding, and (4) drying. The prepared pure aerogel or fiber/aerogel composite is further processed by steps of: (5) polymer solution impregnating, (6) solvent drying and (7) crosslinking-solidifying to obtain a polymer/aerogel composite or a polymer/fiber/aerogel composite featuring of high strength, low thermal conductivity, low-DK and low-DF. The method provided by the present invention does not involve highly conductive solvents or additives, and a highly porous structure is formed so that the dielectric constant and dielectric loss of the aerogel material are significantly reduced, suitable for 5G communications, microwave circuits, protection and insulation for electric vehicle lithium battery modules.
A method for making a low thermal conductivity and low-k dielectric aerogel material, wherein the aerogel material comprises a pure aerogel, a fiber/aerogel composite, a polymer/aerogel composite, or a polymer/fiber/aerogel composite and the method comprising steps of:
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