Heat dissipating device

A heat dissipating device comprising:

• a thermal board having
• at least two chambers formed inside the thermal board;
• said at least two chambers each having
• a first inlet connected to an end of the respective chamber;
• and
• at least one first outlet connected to another end of the respective chamber through an outlet recess corresponding to each of the at least two chambers;
• a first evaporating section adjacent to the first inlet;
• a second evaporating section adjacent to the at least one first outlet;
• a passive one-way valve section located between the first evaporating section and the second evaporating section;
• the first evaporating section, the passive one-way valve section, and the second evaporating section being sequentially connected to each other;
• at least two cooling fins each having
• an inner space;
• at least one second inlet and a second outlet formed by the inner space;
• the at least one second inlet being connected to the at least one first outlet;
• the second outlet connected to the first inlet;
• and
• a working fluid filled in the at least two chambers and the inner spaces of the at least two colling fins;
• the passive one-way valve section configured to limit the working fluid to cycle in the at least two chambers of the thermal board and the inner spaces of the at least one-two cooling fins along a single direction,
• wherein the outlet recess fluidly connected to a first chamber of said at least two chambers and the outlet recess fluidly connected to a second chamber of said at least two chambers are fluidly separated from each other.