Integrated mechanical aids for high accuracy alignable-electrical contacts

A two-piece device for electrically connecting two components, the device comprising:

• (a) a first structure disposed on a first metal bond pad of a first electrical circuit of a first one of said two components, wherein the first structure has
• a tapered sidewall, and
• is comprised of a metal, and
• (b) a second structure disposed on a second metal bond pad of a second electrical circuit of a second component, wherein
• the second structure is complementary to, and mates with, the first structure,
• the second structure is comprised of a metal with a corresponding tapered sidewall that engages the tapered sidewall of the first structure when the second structure mates with the first structure, imparting a lateral shear force.

A method for electrically connecting two integrated circuits, the method comprising:

• providing a first integrated circuit that includes a first electrical bond pad;
• forming on the first electrical bond pad a first structure, wherein the first structure is comprised of a first metal, the first structure having a shape that is selected from the group consisting of cones, truncated cones, pyramids, wedges, and frustra, and wherein a surface of the first structure is tapered,
• providing a second integrated circuit that includes a second electrical bond pad,
• forming on the second electrical bond pad a second structure, wherein the second structure is comprised of a second metal, the second structure having a shape that is complementary to the shape of the first structure with a corresponding tapered surface thereby allowing the second structure to engage the first structure as said corresponding tapered surface of the second structure engages said tapered surface of the first structure, and
• disposing the first integrated circuit on the second integrated circuit such that the first structure mates with the second structure via a lateral shear force imparted by the tapered surface of the first structure and the corresponding tapered surface of the second structure.

A method for laterally aligning two components, the method comprising:

• providing a first component;
• forming on the first component a first structure, wherein the shape of the first structure is chosen from the group consisting of cones, truncated cones, pyramids, wedges, frustra and geometric objects whose cross-sectional areas are larger at a base of the geometric object than at a distil end of the geometric object, and
• a surface of the first structure is tapered,
• providing a second component;
• forming on the second component a second structure,
• wherein
• the shape of the second structure is complementary to the first structure with a corresponding tapered surface, and
• disposing the first component on the second component such that the first structure mates with the second structure via a lateral shear force imparted by the tapered surface of the first structure and the corresponding tapered surface of the second structure.

An apparatus electrically connecting two integrated circuits, the apparatus comprising:

• a first integrated circuit that includes a first electrical bond pad,
• a first structure on the first electrical bond pad comprised of an electrically conductive material, the first structure having surface or sidewall that is tapered, and
• a second integrated circuit that includes a second electrical bond pad,
• a second structure on the second electrical bond pad comprising an electrically conductive material and having a shape that is complementary to, and mates with, the first structure with a corresponding tapered surface or sidewall, a portion of said corresponding tapered surface or sidewall of the second structure engaging the surface or sidewall of the first structure when the integrated circuit is disposed on the second integrated circuit such that the first structure is in a mating relationship with the second structure via a lateral shear force imparted by the tapered surface or sidewall of the first structure and the corresponding tapered surface or sidewall of the second structure.

An apparatus laterally aligning two components, the apparatus comprising:

• a first component,
• a first structure formed on the first component, wherein a surface or sidewall of the first structure is tapered,
• a second component,
• a second structure formed on the second component with a corresponding tapered surface or sidewall, and
• the first component is disposed on the second component such that at least a portion of said corresponding tapered surface or sidewall of the second structure engages the tapered surface or sidewall of the first structure to effect lateral relative movement between the first component and the second component via a lateral shear force imparted by the tapered surface or sidewall of the first structure and the corresponding tapered surface or sidewall of the second structure.