Method for manufacturing electronic device

A method for manufacturing an electronic device, the method at least comprising:

• a step (A) of preparing a structure which includes a wafer including a circuit forming surface, and an adhesive film bonded to the circuit forming surface side of the wafer;
• a step (B) of back-grinding a surface of the wafer on a side opposite to the circuit forming surface side;
• and
• a step (C) of removing the adhesive film from the wafer after the adhesive film is irradiated with an ultraviolet ray,
• wherein the adhesive film includes a base material layer, and an adhesive resin layer configured with an ultraviolet curable adhesive resin material, provided on one surface side of the base material layer, and
• regarding the ultraviolet curable adhesive resin material, when a storage elastic modulus at 5° C. is defined as E′ (5° C.) and a storage elastic modulus at 100° C. is defined as E′ (100° C.) in a case where a viscoelastic characteristic is measured by the following procedures (i) and (ii), E′ (5° C.) is 2.0×106 to 2.0×109 Pa, and E′ (100° C.) is 1.0×106 to 3.0×107 Pa,
• [Procedure]
• (i) a film having a film thickness of 0.2 mm is formed using the ultraviolet curable adhesive resin material, the film is irradiated with an ultraviolet ray having a main wavelength of 365 nm at an irradiation intensity of 100 mW/cm2 with an ultraviolet ray amount of 1,080 mJ/cm2 using a high-pressure mercury lamp in an environment at 25° C. for ultraviolet curing, and a cured film is obtained,
• (ii) a dynamic viscoelasticity of the cured film is measured at a frequency of 1 Hz and a temperature of −50° C. to 200° C. in a tensile mode.