Machine measurement metrology frame for a lithography system
AssigneeApplied Materials, Inc.
InventorsUlrich Mueller, David Arthur Markle, Stephen F. Sporer
Life of this patent
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Abstract
The present disclosure relates to apparatus and methods for performing maskless lithography processes. A substrate processing apparatus includes a slab with a plurality of guiderails coupled to and extending along the slab. A first shuttle is disposed on the plurality of guiderails, a second shuttle is disposed on the first shuttle, and a metrology bar is coupled to the second shuttle. The metrology bar includes a first plurality of sensors coupled to the metrology bar. A second plurality of sensors coupled to the metrology bar are disposed laterally inward of the first plurality of sensors.
Claims19
A substrate processing apparatus, comprising:
- a slab;
- at least one guiderail coupled to and extending along the slab;
- a first shuttle disposed on the at least one guiderail;
- a second shuttle disposed on the first shuttle;
- and
- a metrology bar coupled to a bottom of a chuck that is disposed on the second shuttle, wherein each distal end of the metrology bar extends laterally beyond a perimeter of the chuck, the metrology bar comprising:
- at least one first sensor coupled to at least one distal end of the metrology bar;
- and
- at least one second sensor laterally inward of the at least one first sensor.
A substrate processing apparatus, comprising:
- a slab;
- at least one guiderail coupled to and extending along the slab;
- a processing unit coupled to the slab by a support;
- a first shuttle disposed on the at least one guiderail;
- a second shuttle disposed on the first shuttle;
- a chuck disposed on the second shuttle;
- and
- a metrology bar coupled to a bottom of the chuck, wherein each distal end of the metrology bar each extends laterally beyond a perimeter of the chuck, the metrology bar comprising:
- at least one first scale coupled to the metrology bar;
- and
- at least one second scale coupled to the metrology bar laterally inward of the at least one first scale.
A substrate processing method, comprising:
- positioning a substrate on a chuck, wherein the chuck is coupled to a second shuttle disposed on a first shuttle;
- determining, via a metrology bar coupled to a bottom of the chuck comprising one of a first sensor or scale and one of a second sensor or scale coupled to the metrology bar laterally inward of the first sensor or scale, a position of the substrate within a processing unit, wherein each distal end of the metrology bar extends laterally beyond a perimeter of the chuck;
- and
- in response to determining the position of the substrate, moving one or both of the first shuttle and the second shuttle to position the substrate relative to the processing unit.
Dependencies are inferred from the claim text.