Composition for forming organic film, patterning process, and compound and polymer for forming organic film
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsDaisuke Kori, Yasuyuki Yamamoto, Naoki Kobayashi
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AssigneeShin-Etsu Chemical Co., Ltd.
InventorsDaisuke Kori, Yasuyuki Yamamoto, Naoki Kobayashi
Estimating the term…
The present invention is a composition for forming an organic film, containing: a material for forming an organic film shown by the following general formula; and an organic solvent, where R1 represents a hydrogen atom, an allyl group, or a propargyl group, R2 represents a nitro group, a halogen atom, a hydroxy group, an alkyloxy group having 1 to 4 carbon atoms, an alkynyloxy group having 2 to 4 carbon atoms, an alkenyloxy group having 2 to 4 carbon atoms, a linear, branched, or cyclic alkyl group having 1 to 6 carbon atoms, a trifluoromethyl group, or a trifluoromethyloxy group, m=0 or 1, n=1 or 2, l=0 or 1, k represents an integer of 0 to 2, W represents a divalent organic group having 1 to 40 carbon atoms, and each V independently represents a hydrogen atom or a linking moiety. This provides a composition for forming an organic film which allows the formation of an organic film having not only excellent heat resistance and properties of filling and planarizing a pattern formed on a substrate, but also favorable film-formability and adhesiveness to a substrate.
A composition for forming an organic film, comprising:
A compound shown by the following general formula (1),
A polymer having a repeating unit shown by the following general formula (3),
Dependencies are inferred from the claim text.