Back to results
US 12,442,982 B2Granted
Temperature sensor to achieve thermal stabilization of micro-ring resonator (MRR) in an open cavity photonic integrated circuit (OCPIC)
AssigneeIntel Corporation
InventorsChia-Pin Chiu, Kaveh Hosseini, Omkar Karhade, Tim Tri Hoang
Life of this patent
Estimating the term…
Abstract
Embodiments disclosed herein include an optoelectronic system. In an embodiment, the optoelectronic system comprises a first substrate, a second substrate over the first substrate, and a micro-ring resonator (MRR) over the second substrate. In an embodiment, a heater is integrated into the MRR, a cladding is over the MRR, and a temperature sensor is over the MRR in the cladding.
Claims20
An optoelectronic system, comprising:
- a first substrate;
- a second substrate over the first substrate;
- a micro-ring resonator (MRR) over the second substrate;
- a heater integrated into the MRR;
- a cladding over the MRR;
- and
- a temperature sensor over the MRR in the cladding.
4 more elements
An optoelectronic system, comprising:
- a waveguide;
- a micro-ring adjacent to the waveguide;
- a heater within a perimeter of the micro-ring;
- and
- a sensor directly over the micro-ring.
2 more elements
An optoelectronic system, comprising:
- a package substrate;
- a photonics integrated circuit (PIC) coupled to the package substrate, wherein the PIC comprises:
- a first substrate;
- a second substrate over the first substrate;
- a micro-ring resonator (MRR) over the second substrate;
- a heater integrated into the MRR;
- a cladding over the MRR;
- and
- a temperature sensor over the MRR in the cladding;
- and
- an electronic integrated circuit (EIC) coupled to the PIC.
8 more elements
Dependencies are inferred from the claim text.