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US 12,442,097 B2Granted
Electroforming system and method
AssigneeUnison Industries, LLC
InventorsAshwini Sameer Wadhavkar, Dattu Guru Venkata Jonnalagadda, Rajapriyan Rajendran, Gordon C. Tajiri, Udaya Bhaskar Pamidimarri
Life of this patent
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Abstract
An electroforming system and method for electroforming a component that includes a first housing and a second housing, where the second housing can define a conformable electroforming reservoir with a base structure. An electrically insulating sheet covers at least a portion of the base structure and defines a fluid passage where the component is to be located.
Claims16
A system for electroforming a component, comprising:
- a first housing forming a dissolution reservoir, the dissolution reservoir containing an electrolytic fluid;
- a first anode coupled to or at least partially located within the first housing;
- and
- a second housing located exterior of the first housing, the second housing adapted to receive a component, the second housing comprising:
- a frame having an opening;
- a mesh spaced from the component and coupled to the frame to define a base structure, wherein the mesh spans the opening;
- and
- an electrically insulating sheet covering at least a portion of the base structure and wherein the electrically insulating sheet defines a fluid passage, the component to be located in the fluid passage.
5 more elements
Dependencies are inferred from the claim text.