Metal-clad polymer films and electronic devices

A metal-clad polymer film comprising a polymer film adhered to a first metal layer, wherein:

• the polymer film comprises a first thermoplastic polyimide layer, wherein the first thermoplastic polyimide layer is derived from at least three monomers comprising:
• a first dianhydride having ether functionality;
• 70 to 99.9 mol % of a first diamine selected from 1,3-bis(4-aminophenoxy)benzene and 1,3-bis(3-aminophenoxy)benzene;
• and
• 0.1 to 30 mol % of a second diamine having hydrogen bonding;
• the root-mean-square roughness (Sq) of the interface between the polymer film and the first metal layer is less than 1 μm;
• the peel strength between the polymer film and the first metal layer is greater than 5 N/cm after 168 hours of aging at 150° C. when tested for a polymer film having a thickness in the range of from 25 to 75 μm and a first metal layer having a thickness of 18 μm in accordance with IPC-TM-650 test methods;
• the thickness of the first metal layer is 12 μm or less;
• and
• the surface of the polymer film adhered to the first metal layer is not surface treated.