Electroconductive adhesive
AssigneeOsaka Soda Co., Ltd.
InventorsRyo Katou, Masatoshi Okuda, Junichirou Minami, Takamichi Mori
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Abstract
The present invention provides an electroconductive adhesive which is desirably sintered at low temperatures even without pressurization during the sintering of the electroconductive adhesive, and which forms a sintered body that has high denseness and high mechanical strength (shear strength) if used as an electroconductive adhesive. An electroconductive adhesive which contains a solvent and silver particles that have an average particle diameter within the range of from 20 nm (inclusive) to 500 nm (exclusive), wherein the moisture content in the electroconductive adhesive is 1,300 ppm or less.
Claims2
A method for producing a sintered body, the method comprising:
- (a) removing moisture from an electroconductive adhesive containing silver particles and a solvent, wherein a moisture content of the solvent in the electroconductive adhesive is 1300 ppm or less;
- and
- (b) sintering the electroconductive adhesive with the solvent having a moisture content of 1300 ppm or less at a temperature of 150° C. or higher and 250° C. or lower.
Dependencies are inferred from the claim text.