Low dielectric silica powder, resin composition containing the silica powder, and method for manufacturing low dielectric silica powder
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsToshio Shiobara, Hajime Itokawa
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Abstract
A method for manufacturing a low dielectric silica powder incudes heat-treating a silica powder at a temperature of 500° C. to 1500° C. to achieve 0.0005 or less of a dielectric loss tangent of the silica powder at 10 GHz, and etching a surface of the heat-treated silica powder with an etching solution. A silica powder with an extremely small dielectric loss tangent, a resin composition containing the same, and a method for manufacturing a silica powder with a low dielectric loss tangent and strong adhesion at the interface to resin are achieved.
Claims10
A method for manufacturing a low dielectric silica powder, comprising:
- heat-treating a silica powder at a temperature of 500° C. to 1500° C. to achieve 0.0005 or less of a dielectric loss tangent of the silica powder at 10 GHZ;
- and
- etching a surface of the heat-treated silica powder with an etching solution, wherein the low dielectric silica powder has an average particle size of 0.1 to 30 μm and a dielectric loss tangent of 0.0005 or less at 10 GHz, has, inside and on a surface thereof, 200 ppm or less of a metal and/or a metal oxide in terms of mass of each metal, the metal selected from aluminum, magnesium, and titanium, and 10 ppm or less of an alkali metal and an alkaline earth metal in terms of mass of each, and wherein a hydroxy group (Si-OH) content of the low dielectric silica powder is from 135 ppm or more to 300 ppm or less in terms of mass, wherein the hydroxy group content is quantified by measuring the transmittance of a peak near 3680 cm−1 by infrared spectroscopic analysis, and wherein the hydroxy group is inner silanol.
Dependencies are inferred from the claim text.