# US 12,440,161 B2 · Process for manufacturing wearable ring form factor > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,440,161 B2 - Document ID: US12440161B2 - Status: Granted - Kind: B2 - Application number: 17/903,545 - Filed: 2022-09-06 - Published: 2024-03-07 - Granted: 2025-10-14 - Earliest claimed: 2022-09-06 - Assignees: Oura Health Oy - Applicants: Oura Health Oy - Inventors: Teemu Juhani Haverinen; Mikko Latomäki; Jukka-Tapani Mäkinen; Marko Uusitalo; Antti Lämsä - Web page: https://patentgrep.com/patent/US12440161B2 ## CPC - A61B 5/6826: {Finger} - A44C 9/0053: {having special functions} - B29C 45/14065: {Positioning or centering articles in the mould} - B29C 45/14311: {using means for bonding the coating to the articles (B29C45/14795 takes precedence)} - G06F 1/163: {Wearable computers, e.g. on a belt} - G06F 1/1658: {related to the mounting of internal components, e.g. disc drive or any other functional module} - G06F 1/1684: {Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675} - G06F 1/1694: {the I/O peripheral being a single or a set of motion sensors for pointer control or gesture input obtained by sensing movements of the portable computer} - H05K 5/0086: {portable, e.g. battery operated apparatus (casings for switching devices H01H9/02)} - H05K 5/062: {sealed by a material injected between a non-removable cover and a body, e.g. hardening in situ} - B29L 2031/743: {Jewellery} - A61B: DIAGNOSIS; SURGERY; IDENTIFICATION (usefulness limited to only animals A61D) - A44C: PERSONAL ADORNMENTS, e.g. JEWELLERY; COINS - B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00) - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - B29L: INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES ## Abstract Methods, systems, and devices for manufacturing a wearable device are described. A method for manufacturing a wearable device may include coupling a printed circuit board (PCB) to an inner ring-shaped housing that contains a plurality of apertures by aligning a plurality of sensors of the PCB with the plurality of apertures. The method may also include coupling an outer ring-shaped housing to the inner ring-shaped housing by surrounding the inner ring-shaped housing with the outer ring-shaped housing. Additionally, the method may include injecting a filler material through an additional aperture of the outer ring-shaped housing to fill a cavity defined by the inner ring-shaped housing and the outer ring-shaped housing, filling at least a portion of the plurality of the inner ring-shaped housing with the filler material. ## Claims ### Claim 1 A method for manufacturing a wearable ring device, comprising: coupling a printed circuit board to an inner ring-shaped housing comprising a plurality of apertures, the inner ring-shaped housing comprising a first metallic material, wherein coupling the printed circuit board to the inner ring-shaped housing comprises aligning a plurality of sensors of the printed circuit board with the plurality of apertures; coupling an outer ring-shaped housing to the inner ring-shaped housing by at least partially surrounding the inner ring-shaped housing with the outer ring-shaped housing, the outer ring-shaped housing comprising a second metallic material and an additional aperture; and injecting a filler material through the additional aperture of the outer ring-shaped housing to fill a cavity defined at least in part by the inner ring-shaped housing and the outer ring-shaped housing with the filler material, wherein injecting the filler material comprises filling at least a portion of the plurality of apertures of the inner ring-shaped housing with the filler material. ### Claim 2 (depends on 1) The method of claim 1, further comprising: filling an entirety of the plurality of apertures with the filler material so that the filler material within the plurality of apertures is flush with an inner circumferential surface of the inner ring-shaped housing. ### Claim 3 (depends on 1) The method of claim 1, further comprising: filling the plurality of apertures with the filler material so that the filler material extends beyond an inner circumferential surface of the inner ring-shaped housing; and polishing the inner circumferential surface of the inner ring-shaped housing so that the filler material is flush with the inner circumferential surface of the inner ring-shaped housing. ### Claim 4 (depends on 1) The method of claim 1, further comprising: placing the wearable ring device within a mold based at least in part on coupling the outer ring-shaped housing to the inner ring-shaped housing, wherein injecting the filler material is based at least in part on placing the wearable ring device within the mold. ### Claim 5 (depends on 1) The method of claim 1, wherein coupling the printed circuit board to the inner ring-shaped housing comprises: engaging a first set of locating components of the inner ring-shaped housing with a second set of locating components of the printed circuit board to maintain the printed circuit board in a radial orientation of a plurality of radial orientations relative to the inner ring-shaped housing, wherein aligning the plurality of sensors of the printed circuit board with the plurality of apertures is based at least in part on the engaging. ### Claim 6 (depends on 5) The method of claim 5, wherein coupling the printed circuit board to the inner ring-shaped housing comprises: sliding the printed circuit board within a groove of the inner ring-shaped housing, wherein engaging the first set of locating components of the inner ring-shaped housing with the second set of locating components of the printed circuit board is based at least in part on the sliding. ### Claim 7 (depends on 5) The method of claim 5, wherein the first set of locating components comprise one or more protrusions and wherein the second set of locking components comprise one or more grooves or detents, or wherein the first set of locating components comprise the one or more grooves or detents and wherein the second set of locking components comprise the one or more protrusions. ### Claim 8 (depends on 1) The method of claim 1, wherein the outer ring-shaped housing is coupled to the inner ring-shaped housing with a sealing material, wherein the sealing material comprises an adhesive, a welding material, a compression fit component, or any combination thereof. ### Claim 9 (depends on 1) The method of claim 1, wherein the outer ring-shaped housing is coupled to the inner ring-shaped housing based at least in part on the filler material. ### Claim 10 (depends on 1) The method of claim 1, wherein the filler material comprises a transparent epoxy material that is configured to enable transmission of light through the plurality of apertures. ### Claim 11 (depends on 1) The method of claim 1, wherein the first metallic material of the inner ring-shaped housing is the same as the second metallic material of the outer ring-shaped housing. ### Claim 12 (depends on 1) The method of claim 1, wherein the first metallic material of the inner ring-shaped housing is different from the second metallic material of the outer ring-shaped housing. ### Claim 13 (depends on 1) The method of claim 1, wherein the printed circuit board comprises a flexible printed circuit board. ### Claim 14 (depends on 1) The method of claim 1, further comprising: filling the additional aperture of the outer ring-shaped housing with the second metallic material based at least in part on filling at least the portion of the plurality of apertures of the inner ring-shaped housing with the filler material; and polishing an outer circumferential surface of the outer ring-shaped housing based at least in part on filling the additional aperture with the second metallic material.