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US 12,439,826 B2Granted
Integrated MEMS resonator and method
AssigneeIntel Corporation
InventorsMohamed A Abdelmoneum, Eduardo Alban, Whitney Bryks, Brent R. Carlton, Tarek A. Ibrahim, Nasser A. Kurd, Jason Mix, Srinivas Venkata Ramanuja Pietambaram, Sarah Shahraini
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Abstract
An electronic device and associated methods are disclosed. In one example, the electronic device includes a MEMS die located within a substrate, and below a processor die. In selected examples, the MEMS die includes a resonator. Example methods of forming MEMS resonator devices are also shown.
Claims21
An electronic device, comprising:
- a processor die coupled to a substrate;
- a microelectromechanical systems (MEMS) resonator die located within the substrate, and below the processor die;
- and
- one or more first vias coupled between the processor die and the MEMS resonator die, the one or more first vias passing through a portion of the substrate;
- and
- one or more second vias coupled between the processor die and a backside of the substrate, below the MEMS resonator die.
3 more elements
An electronic device, comprising:
- a first semiconductive die and a second semiconductive die coupled to a substrate;
- an interconnect bridge at least partially within the substrate, the interconnect bridge having a first side, and a second side opposite the first side, wherein the first side of the interconnect bridge is coupled between the first semiconductive die and the second semiconductive die;
- a microelectromechanical systems (MEMS) resonator device located on the second side of the interconnect bridge;
- and
- one or more vias coupled between at least one of the first semiconductive die and the second semiconductive die and the MEMS resonator device, the one or more vias passing through the interconnect bridge.
2 more elements
Dependencies are inferred from the claim text.