CMOS fabrication methods for back-gate transistor
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChun-Chieh Lu, Tzu Ang Chao, Chao-Ching Cheng, Lain-Jong Li
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChun-Chieh Lu, Tzu Ang Chao, Chao-Ching Cheng, Lain-Jong Li
Estimating the term…
A device includes a semiconductor substrate, a low-k dielectric layer over the semiconductor substrate, an isolation layer over the low-k dielectric layer, and a work function layer over the isolation layer. The work function layer is an n-type work function layer. The device further includes a low-dimensional semiconductor layer on a top surface and a sidewall of the work function layer, source/drain contacts contacting opposing end portions of the low-dimensional semiconductor layer, and a dielectric doping layer over and contacting a channel portion of the low-dimensional semiconductor layer. The dielectric doping layer includes a metal selected from aluminum and hafnium, and the channel portion of the low-dimensional semiconductor layer further comprises the metal.
A method comprising:
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A method comprising:
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